Beijing Power Stencil is the high-tech innovation company in Changping Park in Zhong guancun Innovation Park, and it is the branch company for Shenzhen Power Stencil with original name of Beijing Sifang Lihua technology Co., Ltd. It was first one who stepped into the SMT industry in North China region in 2001.

Profession comes from all of us.

We have been cooperated with Tsinghua University in the program of “R&D for printing stencil.
used in IC flip chip packaging”, and the program code is 07Z112.